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Press Releases

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25. October 2011 | Press Releases

Infineon Technologies entwickelt hocheffiziente GaN-auf-Si-HEMT-Transistoren mit AIXTRON G5-Anlage

Mit der erfolgreichen Abnahme einer 8x6-Zoll AIX G5 HT MOCVD1-Anlage im September 2011 hat AIXTRON Kunde Infineon Technologies das erste Planungsziel bei der Entwicklung seiner GaN-auf-Si2 HEMTs3 erreicht. Die neue Anlage ist zusätzlich für die Herstellung von 5x8-Zoll-Wafern optimiert.

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11. October 2011 | Press Releases

China’s NEDI to investigate power devices and LEDs with AIXTRON systems

AIXTRON SE today announced that Nanjing Electronic Devices Institute (NEDI), an existing customer and a leading manufacturer of electronic components in China, has placed an order for one AIX 2600G3 IC system in a 12x4-inch wafer configuration and one VP2400HW with 6x4-inch wafer capacity. NEDI will use the systems to investigate power devices and LEDs.

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26. September 2011 | Press Releases

Korea´s LG Electronics receives AIXTRON G5 system for GaN/Si applications

AIXTRON SE today announced that LG Electronics Woomyeon R&D Campus (LG Electronics Advanced Research Institute), an existing customer in South Korea, has placed an order for one AIX G5 HT MOCVD system in a 8x6-inch wafer configuration. LGE will use the system to develop GaN-on-Si Power Electronics in partnership with AIXTRON.

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22. September 2011 | Press Releases

AZUR SPACE expands terrestrial CPV solar cell production with AIXTRON MOCVD technology

AIXTRON SE today announced that its MOCVD system technology has been successfully implemented at AZUR SPACE Solar Power GmbH. The Heilbronn, Germany based company has expressed its complete satisfaction with the performance capabilities and AIXTRON service for the production of concentrator photovoltaic (CPV) solar cells for terrestrial applications.

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20. September 2011 | Press Releases

Infinera to scale next generation´s Photonic Integrated Chips with AIXTRON system

AIXTRON SE today announced an order for an MOCVD reactor from new customer Infinera. The California-based company placed the order for one AIX 2600G3 IC deposition system during the first quarter of 2011. Following delivery in the third quarter of 2011, the system will be used for next generation InP Photonic Integrated Circuits (PICs). The system is capable of growing 49x2, 12x4 or 7x6 inch wafers.

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Event calendar

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Event Date Reminder
Publication Group Annual Financial Report 2024 Date February 27, 2025 Reminder Erinnerung
Publication of Group Quarterly Report Q1/2025 Date April 30, 2025 Reminder Erinnerung
Annual General Meeting 2025 Date May 15, 2025 Reminder Erinnerung
Publication Half-Year Group Financial Report H1/2025 Date July 31, 2025 Reminder Erinnerung
Publication 9 Month Group Financial Report Q3/2025 Date October 30, 2025 Reminder Erinnerung

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