AIXTRON ships another next generation QXP-8300 ALD deposition tool to major Korean customer

“Selection of the QXP-8300 for this demanding customer clearly validates AIXTRON’s proven expertise in depositing advanced and complex materials to support sub 30nm device development” says Dr. Sasangan Ramanathan, AIXTRON Inc. CTO. “As device manufacturers race to fabricate higher density memory chips, the QXP-8300 product offers them the unique capability of rapid transition from R&D to high volume manufacturing,“ he further adds. The QXP-8300 is now “firmly established at major memory manufacturers as the winning solution for sub 30nm nodes, offering superior technology, extendibility and production worthiness.”

“Planned, fast installation of the QXP-8300 at this customer is allowing them to benefit very quickly from the powerful process, COO and CoC capabilities of this next generation ALD tool,” Dr. Bernd Schulte, AIXTRON COO, comments. The installation adds to the growing Asian installed base of tools already working for chip manufacturers. “AIXTRON’s core engineering competency and IP protected technology packaged into the QXP-8300 is being widely accepted by major chip manufacturers as the only option for advanced technology nodes. The designed ability to easily and quickly install the tool delivers yet another competitive advantage in today’s aggressive chip manufacturing market,” Dr. Schulte adds.

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